NW
Packaging & AssemblyFabrication & Surface Engineering

PIC Packaging Center of Competency for Sensing and Quantum Applications at C2MI

By C2MI

A specialized center of competency focused on assembling and packaging key components used in quantum and advanced sensing technologies in Canada. The Center of Competency in Photonic Integrated Circuit (PIC) Packaging for quantum and sensing applications will be based at C2MI in Bromont, Quebec. Supported by the Canadian government, the initiative brings together Aeponyx, HOP Technologies, and Phantom Photonics to strengthen Canada’s domestic capabilities in advanced photonics and quantum technologies. Anchored at C2MI, one of Canada’s leading R&D and commercialization hubs, the initiative is intended to bridge the gap between research, prototyping, and low-volume manufacturing in a field that is critical to enabling scalable quantum systems. It will focus on advanced PIC packaging processes tailored for PIC based quantum technologies, with the objective of standardizing and making novel packaging capabilities available to the broader ecosystem – solving a bottleneck that is critical to scaling PIC based quantum technology. Central to the project is the installation at C2MI of state-of-the-art packaging equipment specifically designed for PIC based quantum computing applications, made possible through Aeponyx’s long-standing partnership with Aixemtec Gmbh, a leading German equipment manufacturer. The first phase of the project will establish low-volume manufacturing capabilities and is intended to support thousands of devices. The second phase aims to scale production to 500,000+ modules per year.