By Atomica
Atomica's new Physical AI Sensor Platform brings together MEMS, microfluidic, optical, packaging, interconnect, and functional-layer capabilities to help customers turn new sensor concepts into manufacturable devices. The platform spans five major sensor families: motion and inertial; pressure, force and acoustic; environmental and chemical; magnetic and position; and optical and spectral sensing. Devices can include accelerometers, gyroscopes, pressure and flow sensors, microphones, gas and chemical sensors, magnetic and position sensors, microlenses, micromirrors, spectral sensors, and LiDAR-related structures. Pressure sensors, microphones, flow sensors, and microfluidic valves may rely on diaphragm structures. Accelerometers, gyroscopes, resonators, and optical scanners may use released MEMS structures and controlled mechanical motion. Gas sensors, biosensors, and environmental sensors may require membranes, heaters, electrodes, and functional materials. Optical devices may incorporate microlenses, micromirrors, optical benches, and wafer-level packaging, while compact sensor modules may also require TSVs, TGVs, interposers, and other package structures. The platform draws on Atomica's capabilities including deep silicon etching, thin-film deposition, membrane and cavity formation, wafer bonding, metallization, optical coatings, microfluidics, through-wafer interconnects, interposers, and wafer-level packaging. Different devices use different combinations of these capabilities, allowing customers to build on established process knowledge rather than starting from zero. Sensors may require vias, redistribution layers, optical windows, fluidic ports, cavities, seals, interposers, and wafer-level packaging to connect the sensing element with readout electronics, local processing, and system control. Customers can begin with a sensing concept, material, device architecture, or proof of principle and progress through feasibility structures, engineering samples, prototype hardware, qualification, pilot production, and scalable manufacturing.
