We support a range of advanced packaging use cases including 2.5D integration, which connects logic, I/O and HBM through silicon interposers and bridges and 3D integration, which stacks memory or I/O directly on logic for tighter coupling and higher compute density. These approaches allow customers to reuse IP across product generations, combine dies from multiple foundries and keep non‑scaling functions like I/O and SRAM on mature, cost‑effective nodes.
