NW
Packaging & AssemblyFabrication & Surface Engineering

Backend Turnkey Service

By SMIC

SMIC offers comprehensive services from wafer manufacturing to finish goods IC to customers. SMIC cooperates with world-class OSAT (Outsourced Semiconductor Assembly and Test) to offer more comprehensive services for customer requirements, including Wafer Bumping, Wafer Level Package, Chip Scale Package, Conventional Package, Testing and On-chip Color Filter services. Benefits of SMIC Turnkey Service Experienced One-Stop Management 20 years experience of one-stop Turnkey service More than 10 million wafers TK management experience Integrated quality system Strong quality control till assembly with fab criteria One-stop quality solution for customer Diversified Supply chain Manage more than 20 OSATs, including mainstream suppliers and process solutions Low cost solution or Tier 1 OSAT cooperation offered Optimized technical solutions Total Technical Solutions for platform and product verification with Fast Ramp Systematic CPI risk assessment and verification process Flexible business model Flexible Turnkey Model choices Flexible price solutions and inventory management Feasible Production Plan Seamless Planning System. Flexible Capacity Arrangement from foundry to OSATs Simplified Logistic flow. Competitive production and logistic cycle time If you have backend requirement, please contact SMIC Sales Team.