Substrates up to 8” diameter * Holders to accommodate multiple smaller substrates * “Sputter up” orientation * Base pressure 5 x 10-8 Torr * Six-position auto-loading cassette for fully automated runs * 5 UHV sputtering sources (A340-XP). Sources use 4” targets * One (1) 1500 W DC sputtering power supply * One (1) 600 W RF sputtering power supply * RF (100 W) and DC (1000 V) substrate bias capability * Quartz Crystal Monitor to calibrate deposition rates * Ar, N2, and O2 sputtering gases allow for reactive sputtering * Substrate heating to 800°C
Compiled from http://www.ajaint.com
