Sputter-up tool for samples up to 4” diameter * 5 x 10-8 Torr base pressure * Four (4) sputter guns, capable of sequential or co-deposition with all four guns * (2) Stiletto ST20 magnetrons for 2” targets * (2) Stiletto ST30 magnetrons for 3” targets * Quartz crystal monitor (QCM) for deposition rate calibration * A selection of power sources: DC, RF, pulsed DC, and HiPIMS * Process gas delivery: Ar, O2, N2. * Substrate heating up to 1,000°C with reactive gas ring and RF bias * k-Space Associates ICE thin film monitoring system (see below) * Load lock for fast sample turnaround * Large Wafer Direct Deposition Add-on Chamber * Full wafer direct deposition capability (up to 6”) * 6” magnetron for uniformity of coating * Sputter down orientation * Electrically isolated stage for DC bias * Same power supplies and process gases as in main chamber
Compiled from http://www.ajaint.com
