By Institut Catala de Nanociencia i Nanotecnologia (ICN2)
Packaging is often the final step in making a nanofabrication device functional as a stand-alone device or in the context of an integrated system. The devices may need to be electrically connected to an interface via a process of gold or aluminium wire bonding. ICN2 Nanofabrication facility houses a wedge-wedge wire bonder. Technique: Wedge Wire Bonder Instrument: West-bond 7476E Defining feature: Aluminum and gold bonding
