By Colorado Shared Instrumentation in Nanofabrication and Characterization (COSINC)
NQN will feature 30 quantum device nanofabrication tools. Optical profilometer - Sensofar Metrology S neox 3D Spectroscopic ellipsometer - J.A. Woollam M-2000 Photonics wire bonding - NANYTE BEAM (fiber to chip, chip to chip) 4-point probe - Signatone CM-210 Scanning electron microscope - FEI Scios 2 HiVac (focused ion beam) Lithography: Mask aligner - OAI 806 EIR (front and back side); Mask laser writer - Raith PICOMASTER XF 200 (direct write) Thin film deposition: Thermal evaporator - Angstrom Engineering NextBase; Sputter coater - Angstrom Engineering SputterBase; Atomic layer deposition - Forge Nano Theia; Rapid thermal annealer - Solaris 150; E-beam evaporator - Angstrom Engineering Quantum Series (Ar ion milling); Low pressure chemical vapor deposition - Tystar Tytan Mini 3600; Plasma enhanced chemical vapor deposition - Plasma-Therm Corial D250L Metrology: Optical profilometer - Sensofar Metrology S neox 3D; Contact profilometer - KLA Tencor P-7; 4-point probe - Signatone CM-210; Spectroscopic ellipsometer - J.A. Woollam M-2000; Optical microscope - KEYENCE VHX-X1 (up to 150x); Scanning electron microscope - FEI Scios 2 HiVac (focused ion beam) Thermal processing: Vacuum ovens - Yield Engineering Systems YES-310TA Dual; Digital hotplates - SiSTEM Technology Apogee Bake Plate Etchers: ICP RIE - Plasma-Therm Corial 210IL (Nitride/Si-based materials); ICP RIE - Plasma-Therm Takachi (III-V); ICP RIE (Versaline DSE) (Metals) - Plasma-Therm Corial 210IL (Li Niobate); HF vapor etcher - KLA Primaxx uEtch; Asher - Yield Engineering Systems YES-CV200RFS (O2 plasma) Packaging: Wafer bonding - SiSTEM Technology Apogee Temporary Wafer Bonder; Wire bonding - WestBond 7KF (Al, automatic); Wire bonder - WestBond 7KF (Au); Flip-chip bonder - SETNA AccµRa-M; Critical point dryer - Leica EM CPD300; Scribe and break tool - Ted Pella PELCO LatticeAx 420; Photonics wire bonding - NANYTE BEAM (fiber to chip, chip to chip); Wafer dicing saw - Disco DAD3221 Toxic gas cabinets: Gas cabinets - Stainless Design Concepts (Cl2, BCl3, SiH4, NH3); Scrubber - Stainless Design Concepts (abatement system)
