By Fraunhofer Institute for Reliability and Microintegration (IZM)
Research at Fraunhofer IZM means exploring and innovating application-driven, technologically advanced electronic systems and microsystems. The Institute believes in holistic system development that guarantees a long, reliable and functionally secure working life for electronic systems. Chiplet assembly, hybrid bonding, Si interposer technologies, fan-out wafer level packaging (FOWLP), cryo-packaging, high-bandwidth memory (HBMs) integration, RF characterization, and packaging for 5G / 6G applications are just a selection of the many technologies and services from our portfolio that help advance the technologies of tomorrow.
