By UMC
UMC began shipping 14nm customer wafers in early 2017 and has achieved industry-competitive yields for this advanced FinFET process, which is being utilized for leading-edge high performance electronic applications. UMC’s14nm production takes place at the company’s Fab 12A in Tainan, Taiwan and we plan to steadily ramp 14nm manufacturing capacity according to customer demand. UMC's self-developed 14nm FinFET technology features advancements such as Fin module, High-k/Metal Gate stack, low-k spacer, strain engineering, and MoL (middle of line) as well as BEOL (back end of line) modules. This process technology is ideal for applications that require high performance and low power consumption within the same design.
