SUNY Polytechnic Institute is taking a major step forward in advancing semiconductor innovation with the upcoming Semiconductor Processing to Packaging Center. This state-of-the-art facility will serve as a hub for research, education, and collaboration, supporting next-generation technologies in power electronics, optoelectronics, and clean energy applications. Key Highlights - $16 Million Investment from New York State to establish the Processing-to-Packaging Center. - $4 Million ESD Grant dedicated to a full suite of advanced metrology equipment. - $6.5 Million Pending for outfitting the facility and providing scholarships and student support. Facility Features - Approximately 5,000 ft² of cleanroom space for advanced device processing in the Quad C building. - Capability to process silicon devices as well as SiC, GaN, AlN and their alloys, and Ga₂O₃ devices, addressing unique packaging needs for each. Impact and Vision The Center will enable cutting-edge research and development for: - Power electronics - Optoelectronics - Clean energy applications SUNY Poly is also committed to developing a robust research ecosystem through partnerships with regional, state, and national collaborators, fostering innovation and workforce development in the semiconductor industry.
