Rogue Valley Microdevices provides dry etch services for silicon wafers, MEMS devices, and semiconductor thin films, including DRIE deep reactive ion etching and plasma etching. Our engineers work directly with you to select the right etch chemistry, mask materials, and process conditions for each application. Because our dry etch tools operate inside a full MEMS foundry environment, you gain production-grade wafer processing that supports both device development and manufacturing, with wet etch, lithography, and thin-film deposition available on the same line. Dry etch can run as a standalone wafer service or as part of a fully integrated device fabrication flow. Etch, Lithography, and Deposition Under One Roof Plasma dry etching plays a key role after photolithography patterning, where patterned photoresist masks define the areas of material removal. Because thin-film deposition, masking, etch, and metrology all happen in one fab, we can tune each step against the ones around it instead of handing wafers between vendors. Etch Verification and Process Monitoring Every etch runs with verification built in. We measure etch depth against target, monitor uniformity across the wafer, and track run-to-run repeatability so results stay consistent from wafer to wafer and lot to lot. Each step is recorded on process travelers, giving you a traceable record of exactly how your wafers were etched. Applications for Dry Etch and DRIE Engineers rely on plasma etch and DRIE processes to shape materials with the accuracy required for advanced microtechnology. Common applications include: - MEMS pressure sensors - Accelerometers, gyroscopes, and inertial measurement units (IMUs) - Microfluidic and biomedical MEMS devices - RF MEMS switches - Optical MEMS structures - Silicon microcavities and trenches Request a Quote for Dry Etch Services Send us your device geometry, substrate, and target features, and our process engineers will recommend the right dry etch approach and turn around a practical quote.
