Stealth Laser Dicing is a zero-waste, dry process which does not require any cleaning. Kerf width can be drasticly reduced. Stealth Laser can be applied to multi-project-wafers or MEMS and various Silicon based materials, as the dry process suits products which have to be protected from water or contamination. Stealth Laser Dicing is a two-stage process. Firstly, the laser beam is focused in the inside of the Silicon wafer creating an amorph layer. Secondly, in order to separate the dies, external force is applied to singulate the dies along the modified layer.
