By Tempress
Diffusion. Diffusion processes are used in semiconductor manufacturing to modify the electrical properties of the wafer material, typically by introducing dopant atoms into the wafer material from a chemical vapor source or by annealing the crystal defects. Tempress offers a wide range of diffusion processes from high temperature annealing (up to 1365°C ), wet and dry oxidation and Phosphorus and Boron doping with POCI 3 and BBr 3, to lower temperature (<500°C) sintering, alloying and annealing with up to 100% H 2.
