The process of separating the wafer into individual semiconductor chips, and place them into protective package. Photoresists and other chemicals provided by TOK are also used in this area. Packaging Process - Photoresist coating - Exposure - Development - Plating process - Photoresist cleaning - Coating on the back - Dicing - Molding Process.15 Photoresist coating Apply a photoresist to the silicon substrate after the completion of the upstream process. Process.16 Exposure Circuit design of photomask is transferred to coated photoresist film by irradiation of light. Process.17 Development The photoresist pattern is formed by development. Process.18 Plating process Using the resist pattern as a mold, form connector on pillars known as BUMPs. Process.19 Photoresist cleaning Use a cleaning solution to remove any photoresist that is no longer needed. Process.20 Coating on the back Coat the backside of the silicon substrate with the sealant. Process.21 Dicing Wafer is diced into chipsize components. Process.22 Molding Set and fix cut-out semiconductor chips onto a substrate
