By UMC
Our 28nm process technology uses new stress techniques (SMT, t-CESL, c-CESL) and embedded SiGe to enhance electron mobility performance, and is ideal for applications that require high performance and low power consumption. We have years of experience in high volume production for numerous customer products on both UMC's 28 HLP SiON and 28 HPC / HPC+ High-K-Metal Gate processes and have ample capacity to meet the high customer demand for this popular mainstream process technology.
