By IMT Masken und Teilungen AG
Laser dicing technology represents the next generation of high-speed, high-precision scribe-and-break processing. An ultra-short pulsed laser creates the high-precision scribe line, while a second laser induces localized thermal stress to propagate the crack along the predefined path. The process removes no material and is completely debris-free and cooland-free, leaving pristine surfaces and superios cut-edge quality. Substrates: all transparent materials with CTE > 3.0 Substrate thickness: ≥ 0.2 mm Dimensions: ø ≤450 mm Shape: free form Edge breakouts: < 50 µm
