By DB HiTek
The ShuttleChip (MPW: Multi Project Wafer) program allows customers to perform trial production of their semiconductor designs on a shared wafer, helping to verify the feasibility of commercial manufacturing. It reduces the cost burden for fabless companies and supports close collaboration between fabless and foundry partners across the entire semiconductor development process, from early-stage design and prototyping to mass production. 2026 ShuttleChip Schedule ShuttleChip contents Process | Process Detail | Tech | Fab | 1Q | 2Q | 3Q | 4Q Analog/ BCD AN07 | 0.18µm | Fab1 or Fab2 AN180 HP180 BD180LV BD180MV BD180XH BD180XA AN180 BD180LV BD180XH BD180XA BCD VD180LV | 0.18µm | Fab1 Analog/ BCD BD180LVA | 0.15µm | Fab1 or Fab2 BD180LVB AN180 Gen2 BCD BD180LVA | 0.15µm Analog/ BCD/SOI BD130 | 0.13µm | Fab2 RS13 Mixed Signal / RF HRS | 0.11µm | Fab2
