AdvanceTEC is the market leader of turn-key design build cleanrooms for nanotechnology and semiconductor device fabrication “fabs.” Our advanced 3D BIM / VDC modeling, high purity process integration, and fast-track clean build methodologies have been leveraged by leading tech companies ranging from venture capital backed start-ups to global technology leaders. Our skillset serves customers well across projects ranging from pilot lines, high volume fabs, or foundry applications—regardless of wafer size or if your process is CMOS, GaAs, GaN, or other advanced composite materials. We’ve delivered Class 10 / ISO 4 photo bays, Class 100 / ISO 5 deposition areas, Class 1,000 / ISO 6 metrology & metals cleanroom areas, and more to our customers. AdvanceTEC has segment expertise in-house to handle your most pressing technology and project challenges. Cleanroom Fab Design Considerations - Bay & chase cleanroom design configuration - Ballroom and RAF (raised access floor) cleanroom design and configuration - FFU (Fan Filter Unit) air delivery and plenum ceiling - Plenum modules 100% filter coverage with flush grid and integrated lighting and sprinkler - Mini-environments - Tool-set layout and process utility generation and distribution - Trace metals or metals free cleanrooms - EMI shielded rooms and service utilities - Vibration free zones - Static control - Light and sound abatement - Radiant cooled areas with ultra-low air velocities Fabrication Cleanroom Systems Experience - Building Automation Systems (BAS) / Building Management Systems (BMS) - High-purity gas cabinets, distribution panels and ventilated enclosures, and gas bunkers - High purity piping and tubing systems - Ultra-Pure Water (UPW) skids and distribution loops - Toxic Gas Monitoring Systems (TGMS) - Scrubbed exhaust systems - Chemical dispense systems - Environmental and particle monitoring systems
