Being a leader in the Vias Technology space, combined with our expertise in Deep Reactive Ion Etching (DRIE) and Wafer bonding, provided a natural segway into an WLP offering. Being a MEMS foundry, mastering all aspects of wafer level integration is a must, but at Silex we are constantly pushing the boundaries of what we can provide. MEMS integration is often the most difficult aspect of a full production flow and pushes the foundry to extremes when it comes to available temperature budgets, demands for high precision and accuracy, and processes that can deal with the most demanding topographies and combination of substrates and materials. Silex Bonding capabilities span a wide temperature range and include Direct bonding, Eutectic bonding, Thermocompression bonding, Anodic bonding and Polymer bonding.
