Nanoshift provides custom Advanced Semiconductor and Advanced Packaging services for wafer and chip level fabrication and integration. Our expertise includes wafer level packaging, interposers, interconnects, thru silicon and glass vias, redistribution layers, damascene, 3D and 2.5D IC architectures, heterogeneous integration of MEMS to CMOS, just to name a few. These solutions support high technology applications that require sophisticated, untraditional, or highly scalable approaches for advanced devices. Through integration across traditional and unique features, materials, devices, structures, and complex architectures, we enable the development of next generation technologies that move the industry faster. Our strong foundation in scalable wafer manufacturing, combined with innovative methods to move beyond Moore’s law, ensures smooth transitions from R&D to production. We address challenges in design, process integration, structural integrity, high-density packaging, and performance for complex designs. Nanoshift offers technical insight and infrastructure needed for precise and adaptable semiconductor and packaging solutions. Contact us to learn how our capabilities can support your specific project requirements.
