Assembly & Packaging occupies a key position in microsystems technology and photonics. It comprises the technologies for connecting microelectronic, micromechanical, microoptical and packaging components to form a system in a very small space. This makes it a decisive prerequisite for the implementation of digitization in many areas, especially in microsensor technology. Ultimately, a specific packaging is necessary for each application, as a wide variety of requirements must be met: - reliable electrical contacting between the electronic components (sensors, actuators, signal processing, etc.) - protection of semiconductors and other sensitive components from physical and chemical environmental conditions by housing - long-term stable and inert behavior towards ambient media such as gases or liquids - advancing miniaturization to realize shortest signal paths, material and mass savings as well as cost reduction and at the same time suitability for series production of all process steps - efficient heat and energy management - the Assembly & Packaging department interacts closely with simulation and design development, system integration technologies, and quality and reliability testing - environmental compatibility (e.g. RoHS, REACH) as well as compliance with specific standards (e.g. in medical technology or the automotive industry)
