Electroplating for small series Electroplating with IMI systems Electroplating of pure metals, such as gold, nickel and copper, as well as alloys of gold and nickel are available for small quantities and R&D batches. This technique is commonly used for microforming applications (filling of high-aspect ratio resist negative forms), e.g. in the fabrication of acceleration sensors or microrelais. As a “cold process”, electroplating is compatible with most CMOS processes, if applied as a back end, post process. microcoil on top For example, special MEMS devices such as acceleration senosrs or gyroscopes can be added on top of finished ASIC wafers
