High mass resolution with mass range 0-12000 a.m.u. Depth profiling using sub keV O or Cs beams (nm depth resolution) 2-D and 3-D ion imaging (100 nm lateral resolution ) Parallel detection - A significant benefit for detecting unknown contaminants at interfaces and analysis of unknown complex structures Retrospective reconstruction of data (including depth profiles) from any region of interest (ROI) post acquisition - off line. Also see DSIMS Applications High depth resolution dopant profiling Surface and interface contamination assessment (organic and inorganic) 2D and 3D chemical imaging and mass spectra Depth profiling of organic materials Reverse engineering Materials Semiconductor materials and processed devices Oxides, high k and low k dielectics Thin films and coatings Optical coatings Diamond and related materials Example of retrospective image and spectra reconstruction
