By UMC
The rise of 5G and the transition to 6G are driving the demand for faster connectivity, while also presenting the challenge of integrating more RF components to support a wider range of applications. UMC’s advanced packaging technologies, RFSOI, and mmWave technologies are accelerating the development of high-speed communications and enabling highly integrated solutions. Related Technologies - Logic/MS - RFCMOS - mmWave - RFSOI - BCD
