High-speed, non-contact coplanarity measurement on balls, pins, pads and more. Coplanarity is essential for many products. Accurately measure and analyze bumps, balls (BGAs), pins (PGAs), pads (LGAs), leads, SMDs and other electronic components for coplanarity using a seating or regression plane analysis. All bumps, leads, pads or any features can be detected automatically based on height, reflectivity or by importing coordinates. Regression Plane Method Seating Plane Method Height Position Coplanarity (Regression plane): Analyze coplanarity based on regression plane following JEDEC specification and diameter in one single measurement. Coplanarity (Seating Plane): Coplanarity based on the seating plane is calculated by defining a plane created by the three highest points that surround the center of gravity while avoiding intersection with other components. All this is done automatically and the center of gravity can be easily adjusted if needed. (Local) Height: The height of each feature (e.g. bump) is measured precisely in relation to its direct surroundings. This approach ensures that height measurements are accurately determined relative to the designated reference, providing precise and consistent data for each single feature. Position: Accurately measure the position of each bump or feature, with the flexibility to reference these measurements against imported nominal values, the best-fit grid or as absolute positions. Our metrology systems offer a wide range of optical sensor technologies, enabling measurement capabilities at nanometer-level resolution. For coplanarity measurements chromatic confocal sensors, confocal microscopy or white light interferometry can be used. The metrology systems can be used to measure a wide variety of products and samples for coplanarity. A breif selection. Bumps on Wafer: Measure an entire wafer with bumps to evaluate coplanarity, analyze (local) height variations and the height distribution across the wafer. Pads: Measure the coplanarity of pads efficiently, whether examining the height of individual pads or multiple pads at once. Connectors, Pins: Measure the coplanarity of connectors, whether individually or multiple connectors simultaneously, with the ability to zoom in on each pin as needed for detailed analysis.
