By Melbourne Centre for Nanofabrication
The intrinsic stress of a film is mainly caused by the atomic structure mismatch between the film and substrate at the deposition temperature. FLX 2320-R uses a laser interferometer to measure the curvature of a wafer with and without film deposition, which is then used in the calculation of the stress in the film deposited on the wafer. FLX 2320-R has two LASER wavelengths - 670 nm and 750 nm.
