Our XSW process technologies are optimized for high-performance RF switching, delivering low insertion loss and strong isolation for high-volume RF front-end modules. Enabled by optimized Ron·Coff through advanced switch architectures and device stacking, XSW supports scalable deployment in smart mobile and connectivity applications. The XSW family includes our established 8SW and latest-generation 9SW technologies, with advanced integration options such as SLATE™ wafer-to-wafer bonding technology on 9SW.
