Clean room is a special laboratory facility, where the level of contamination, temperature, and humidity are carefully controlled. The modern clean room and the related manufacturing devices of the CMA create an excellent research environment to carry out the research related to micro and nanotechnology. Total area of the CMA clean room is 550 square meters. The clean room is divided into three cleanness classes based on the air purity level, covering the ISO-standard classes ISO5-ISO7. The clean room is supplied with ultrapure water, nitrogen gas, and compressed air. The clean room is mainly used in microelectronics materials research and preparation of optical components. Several companies also utilize the facility. The CMA has many fabrication devices dedicated for preparation of micro-and nanostructures. The devices can be divided into thin film deposition, photolithography, etching, laser, and other fabrication instruments. Also, the FIB-FESEM suitable for micro and nanofabrication is in the clean room. Several instruments of the Microelectronics Research Unit are installed in the facility. These instruments include devices related to the printed electronics research and a carbon nanotube (CNT) reactor. Thin Film Deposition: The CMA has two physical vapor deposition (PVD) devices for preparation of metal thin films and plasma enhanced chemical vapor deposition (PECVD) reactor for preparation of dielectric layers. PVD methods include RF-sputtering, e-beam evaporation, and thermal evaporation. Thin films can be deposited from large selection of metals (Pt, Au, Ag, Cu, W, V, Cr, Fe, Ni, Ti...) - Torr International PVD - Kurt J. Lesker PVD 75 - Oxford Instruments Plasmalab 80 Plus PECVD/ICP-DRIE Photolithography: The following instruments for processing of photoresists are available: - Suss RC8 Spinner - Primus STT 15 Spinner - Suss MA8 Mask Aligner - Terra Universal Wet Bench for developing photo resists - Semitoo
