Advanced packaging is a critical component amid growing demand for AI and other data-intensive applications that require compact, high-performance and energy-efficient technology solutions on a single chip. Our next-generation advanced packaging solutions complement our full range of differentiated technologies across our portfolio to provide our customers with an end-to-end solution from design to packaging. With our global manufacturing footprint, we provide the scale and maturity of a world-class manufacturing partner, including the essential enablement and application design kits that accelerate time to market for our customers.
