Producing high-performance PiezoMEMS devices often requires more than piezoelectric thin-film capability in isolation. In many device architectures, piezoelectric layers must be combined with deep silicon etching, wafer bonding, or through-silicon via (TSV) interconnect within the same process flow. One of the more demanding integration challenges is the high processing temperatures required for PZT deposition and crystallisation. Silex’s proprietary Sil-Via® TSV technology has been specifically developed to withstand temperatures up to 1,100°C, making it compatible with the full PZT process flow. This allows vertical electrical interconnect and piezoelectric actuation to coexist in the same device without compromising the integrity of either. For architectures that require both – such as compact, high-density transducer arrays or integrated sensing modules –this is a significant process enabler that very few foundries can offer. The ability to handle these complex, multi-module process flows within a single 200 mm environment is a core part of what Silex offers as a PiezoMEMS foundry partner.
