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Product EngineeringResearch & Engineering

Custom Deposition and Etching System Engineering

By Torr International Services LLC

Sample and Substrate Requirements (Etching requirements/needs if chosen above) Most Common Size of your Substrate Sample and the Material of Sample most commonly deposited on, Rotation only, Rotation and Heating, Substrate cooling only-water or LN2, (plasma etched, reactive ion-etched or ion-milled off from if specification is needed). Deposition Source Requirements and Specifications (Etching requirements/ needs if chosen above) Types of Deposition Sources required, Number of Sources desired, Type of Power Supplies preferred or required, (Etch Rates, CCP or ICP Plasma requirements, Ion Beam Etching, DRIE needs, Oxygen Asher). Deposition Properties and Source Material Properties (Etching requirements/ needs if chosen above) Final Thin-Film Thickness, Deposition Rates, Uniformity requirements, Expected Throw Distance between source and sample, Multilayer Sequential/Simultaneous Deposition requirements, Type of Materials to be deposited, (Common Gas chemistries required for etching, (known plasma etch process parameters, Corrosive gas compatibility requirements, your existing laboratory/facility safety standards for scrubbing noxious effluents). Vacuum system Requirements (Etching requirements/ needs if chosen above) Base Vacuum required, Process vacuum range required, Type of High Vacuum Pumping System, Turbo, Cryo, Diffusion Pumps, roughing/backing pumps, Oil or Dry, traps or mist filters, (Corrosive Compatible Turbo pumping system, Fomblin-Prepped mechanical pump, all stainless steel roughing lines). System Control Requirements and Specifications Manual Controlled, PLC controlled, Semi-automated Deposition control, Fully Automated PC control System Options, Additional accessories (Etching requirements/ needs if chosen above) Unique Custom Engineered solutions to various deposition research needs, special Substrate Sample Carriages, Load Lock requirements, Reel to Reel deposition solutions, Pilot-production capabilities, Closed-Loop Water Chillers, Water cooled vacuum Chambers, Air Compressors with CDA compatible filter stages, Foreline Traps, Oil Mist filters, (Gas Scrubbers, End point-detection)

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