By Holonyak Micro & Nanotechnology Lab
The NPOS RTP 150 rapid thermal process oven is a front-loading system designed for 1 cm x 1 cm samples up to 150 mm wafers, delivering fast, repeatable high-temperature cycles for applications such as RTA, RTO, RTN, dopant diffusion from spin-on sources, crystallization, and contact alloying. It features upper and lower cross IR lamp arrays for excellent temperature uniformity, multi-gas capability (N2 and O2), and rapid vacuum attainment to 1e-3 Torr to shorten process times. The platform supports quick ramp rates with external water-cooled chamber, nitrogen wafer cooling, integrated data logging, and programmable recipes (up to 50 programs with 50 steps) for robust, production-style control. These capabilities make the RTP 150 a versatile workhorse for silicon and compound semiconductor research and low-volume prototyping
