By UMC
UMC’s 22nm process, an optimized platform from based on UMC's 28nm technology for performance enhancement, is currently in volume production. The 22nm superset technology includes both ultra-low power (ULP) and ultra-low leakage (ULL) options on the same platform. It has the same mask count and compatible design rules with the company’s 28nm technology, offering better performance with no added complexity. Chip designers can confidently use UMC’s 22nm design guidelines to gain area benefits and additional performance. The 22nm process platform has fundamental IP support for various semiconductor applications in the market, including consumer electronics such as set-top boxes, digital TVs, monitors, and power or leakage-sensitive IoT chips (with Bluetooth or Wi-Fi) that are more Ideal for wearables requiring extended battery life.
