Secure and residue-free bonding. SUSS Temporary Bonding protects sensitive wafers during complex, multi-step processes – and enables residue-free debonding at critical stages. Confident wafer processing in complex workflows: Our temporary bonding solutions enable easy, residue-free debonding, with no risk to your wafer. Key Benefits - Flexible Carrier Compatibility: Safely bond thin or ultrasensitive wafers with multiple carrier options for total process flexibility in advanced semiconductor and MEMS manufacturing. - Clean Debonding: Secure adhesion in multi-step flows paired with industry-leading, residue-free debonding engineered for contamination-sensitive wafers. - Seamless Multi-Step Processing: Most advanced integration flows, including thinning, lithography, and packaging steps run with ease ensuring the seamless transitions between materials and process stages for high-mix- or complex manufacturing. Smart Metrology for Optimal Quality: Smart metrology features in SUSS Temporary Bonding platforms enhance safety and process control. By detecting wafer warpage and verifying alignment before debonding, the tools prevent damage, ensure accuracy, and safeguard yield in advanced semiconductor workflows. Alignment Verification: Post-bond alignment integrity is verified to ensure readiness for further processing.
