Sputtering Sputtering as a physical vapor deposition techniques (PVD) used at microfab to form metal and compound/alloy thin films on 100 and 150mm wafer substrates. Two sputter systems (batch coater and a single wafer twin-chamber) are installed and mainly used for deposition of thin metal films for interconnection lines and plating bases. The following metals are currently available: Al, AlSiTi, WTi10, W, Au, Pt, Cu, Ti, Cr, Ta Sputtering of dielectric materials is also possible on the Balzers/Ardenne system by using an rf-source instead of the standard magnetron source. Further, reactive sputtering can be applied for deposition of compound materials such as TiO2, TiN or AlN.
