By INESC Microssistemas e Nanotecnologias
INESC MN provides micro and nanofabrication services, from design and simulation to single level and integrated processing, towards microelectronic devices and systems. For a more comprehensive overview of our technologies and equipment check the Facilities menu. - Advanced material development and thin film deposition from our suit of deposition systems (ion beam sputtering, magnetron sputtering and PECVD), including more than 29 sputter targets available simultaneously in the sputtering machines. Thin film thickness from 0.3 nm to several micrometers are possible with good uniformities across (up to) 200 mm wafers. Several substrates sizes, thickness and type are possible (e.g. glass, silicon, flexible coatings). - Lithography: consultation and design of masks, mask conversion and test exposure of the pattern in resist coated substrate of choice, using our photo and e-beam lithography systems. - Patterning: wet and dry etch solutions for selective removal of materials. - Packaging: services for post-processing of devices, from wafer dicing and polishing to wire bonding and encapsulation of individual chips. - Characterization services from material deposition level to microfabricated devices: optoelectronic, micromechanical, material structure characterization, magnetic and electrical characterization, profilometry and ellipsometry.
