By Jan Koum Center for Nanoscience and Nanotechnology, Tel Aviv University
Manufacturer and model: VERSALINE™ LLH-DSE-III Deep Etching System The VERSALINE™ LLH-DSE-III is an advanced plasma-based deep etching system designed for high-aspect-ratio microfabrication and precision material processing. Built on the modular VERSALINE platform, the system delivers excellent process control, repeatability, and uniformity across a wide range of materials. It supports deep etching processes for semiconductors, dielectrics, and other advanced materials. The integrated load lock ensures efficient wafer handling while maintaining a stable and clean vacuum environment. Common Applications: - Deep reactive ion etching (DRIE) - MEMS fabrication - Through-silicon vias (TSV) and advanced interconnects - Microstructure and trench formation - Etching of silicon, dielectrics, and other materials - Semiconductor and microfabrication R&D
