By Universal Display Corporation
We have developed a novel, thin-film encapsulation technology for the ultra-flexible plastic substrate systems. - Effective permeation barrier with hybrid organic-inorganic properties - Transparent and flexible film properties - Effective perimeter coverage for nearly edgeless or ‘bezel-less’ packaging - Enables ultra-flex barrier without cracking down to < 1 mm bend radius - Cost-effective process and compatible with roll-to-roll processing - Well suited for OLED, PV, battery and other thin-film devices
