By UMC
The rapid growth of artificial intelligence (AI) has driven the boosting development of cloud data centers. With the widespread adoption of smart devices and the increase in real-time demands, AI computing is gradually expanding from the cloud to edge computing. To enhance computing performance, advanced packaging technology that combines multiple semiconductor chips into a single electronic package has come into play. This makes it easier for AI to analyze data and make decisions across various applications, improving the user experience. UMC is actively expanding into the AI market, offering a diverse range of advanced packaging solutions for both homogeneous and heterogeneous integration. UMC's 2.5D through silicon interposer (TSI) technology facilitates the horizontal placement and integration of multiple chips with varying functionalities, enabling high-speed interconnection through through-silicon via (TSV) and redistribution layer (RDL). Meanwhile, the 3D IC solution vertically stacks multiple chips to create a three-dimensional integrated circuit design, effectively addressing the demands of AI edge computing for miniaturization, low power consumption, high computational efficiency and fast data transmission.
