By integrating analog, digital and power devices, our BCD technologies deliver efficient mixed–signal power ICs with scalable low to high–voltage operation, integrated passives and embedded memory to enable longer battery life, faster charging and flexible power architectures. Our BCD technologies support 5V to 150V operation, with high-voltage BCD solutions incorporating deep trench isolation up to 200V. Our BCD technologies are manufactured at 300mm across our Malta, Dresden and Singapore facilities, with additional 200mm manufacturing in Burlington and Singapore. Our BCD devices are qualified to meet rigorous automotive standards (Auto Grades 0 and 1), with both BCD and GaN qualified to JEDEC and data center/industrial standards*.
