By memsstar
Advanced Dry Release Processing for Current and Next Generation MEMS Devices. To create a MEMS microstructure, a release etch process is required in order to remove the structural material and leave the mechanical structure with clean and free surfaces. It is essential that removal (etching) of the sacrificial material does not damage or restrict the operation of the MEMS device. To ensure full performance and reliability, the remaining mechanical structure needs to be free from residues, particles and damage, and prepared for the application of an anti-stiction coating or packaging process steps. XERIC™ vapor HF (Hydrogen Fluoride) etching—or vapor phase—sacrificial release etching from memsstar offers many benefits to companies engaged in MEMS development and manufacturing. Using memsstar’s XERIC dry anhydrous HF etching is unique because it eliminates stiction in a single process. The patented process is compatible with the widest wide range of metals—especially Al/alloy and other metals commonly used in MEMS mirrors and electrical contacts. Sacrificial Oxides: Thermal oxide, TEOS, SOI bonded oxide, quartz, PECVD oxide, spin-on oxide, low-temperature spin-on glass Protective Layers: Aluminum, silicon carbide, Si-rich LPCVD nitride, stoichiometric PECVD nitride Metal Layers: Gold, copper, TiW, nickel, aluminum, Ti, TiO2 XERIC Oxide Etch Features Key characteristics Large process window to optimize process for any structure Excellent selectivity with silicon nitride and silicon dioxide (<5% 1σ) High selectivity to underlayer and mechanical materials Industry-leading etch rates High etch rates for undercut and blanket Si Excellent uniformity (<5% 1σ) Excellent repeatability (<5% 1σ) No corrosion No stiction In-line controls—etch rate monitor, endpoint, temperature Unique endpoint capability Application examples Sensors, RF MEMS, micro bolometer arrays, accelerometers, RF switches, temperature gauges As part of memsstar’s ORBIS™ platform, XERIC vapour HF etching scales from R&D through to high-yield manufacturing, making it well suited to companies advancing both established and emerging MEMS applications.
