In addition to supplying enabling optical I/O (input/output) components (PROFA) to you or your preferred packaging vendor for wafer-level probing, coupling or packaging, Chiral Photonics also has provided optoelectronic packaging services that has include both electrical and optical I/O as well as thermal control. We have received customers' diced chips and returned packaged and connectorized devices. More recently our work has focused on more scalable high bandwidth density I/O packaging featuring multicore fiber-based optical I/O that can be passively aligned using standard pick-and-place tooling and is scalable to very high bandwidth I/O. If you have applications that could benefit from this, we'd love to work with you. We aim to work with our customers in the best way suited to their needs. We can help you develop a process and transfer it fully to you or we can provide packaging services. Speak to us early in your design process to discuss your needs with regard to: - Low-loss edge or face coupling for both probing and packaging - Packages customized to application needs for high frequency, low frequency or all-optical/passive I/O and optimized to meet your form factor requirements - Pigtailed or pluggable package designs - Device operating conditions and package/test requirements: cryogenic, high temperature, hermetic Contact us to obtain coupling and packaging design guidelines.
