Full Wafer Packaging - SOI microfab is able to do direct, face-to-face bonding of silicon and pyrex (glass) wafers. The following standard processes are available: - Silicon direct bonding (SDB) - Anodic bonding of silicon to pyrex wafers - Glass frit bonding - Eutectic bonding - High temperature fusion bonding of silicon wafers Thermocompression and Anodic Bonder The Bonder available at microfab is a semiautomatic, computer-controlled, stand-alone substrate bonder equipped with a vacuum/pressure chamber and a loading arm. The machine processes aligned and unaligned 100 and 150mm wafers. The alignment accuracy of this tool is listed as being 3 µm (3 σ). All bonding pair alignment is done on the Bond Alignment tool, the substrate stacks are mechanically clamped using a transport fixture, and then transported and bonded within the chamber. Triple stack bonding is possible.
