By Atomica
Wafer thinning capability is a key tool for reducing the overall profile of a device or to expose materials that are embedded in the wafer. Atomica provides the thickness control as well as both roughness and smoothness of the finished surfaces that our customers desire. The ability to thin wafers is critical to applications that require meeting certain form factors for packaging at the back end of the line assembly, fitting specific thickness profiles. For building more complex layers, the ability to polish heterogeneous material sets simplifies wafer processing by planarizing the surface instead of accommodating topography. Details: Wafer grinding abilities are to +/- 5 µm tool tolerance.
