By UMC
Today's advanced process and package technologies pose challenges to SoC, SIP, and 3D-IC designers in terms of reliability, cost, and performance. UMC has partnered with industry-leading vendors to effectively address these challenges and provide solutions. Customer can benefit from resources such as established and verified design rules, verification of low-K wafer materials and structures, optimized package materials and parameters, and enhanced reliability performance. Sophisticated test vehicles are another advantage achieved through UMC's methodology. Customer endorsed qualification flows and Specs
