By Engent, Inc
Engent provides advanced MEMS (micro electro mechanical systems) technology and packaging services that benefit a wide variety of applications. Designed to protect devices from environmental elements such as moisture, unwanted current and chemicals, MEMS has emerged as a rapidly growing technology as it has proven incredibly useful in meeting the demands of micro-scale applications. MEMS generally consists of the following components: - Micro-sensors - Micro-actuators - Micro-structures - Micro-electronics Each device that employs MEMS technology has its own unique operational demands and considerations that must be made when developing the correct packaging option. Engent's MEMS experts design packages specific to the needs of each device while addressing packaging issues such as media compatibility, stress, integration and testing. Engent's MEMS services include best industry sealing methods for all types of packages, including: - Chip carrier - Pin array - Dual inline packaging (DIP) Engent's engineers and specialists develop both the technology and packaging to ensure proper delivery and performance of applications while shortening time to market utilizing the most cost-effective model possible.
