Method - FIB preparation of lamella and lift-off for microscopy - Sub nm imaging using TEM or STEM - In-situ EDX elemental mapping or EELS - Electron diffraction analysis (lattice parameter) - Plan view or cross section analysis Applications - Microstructure & defects - Layer thickness measurements. - Failure analysis - Reverse engineering Materials - Silicon, III/V and II/VI semiconductors - Patterned wafers, devices or plain samples - PVD, CVD and ALD coatings and thin films - Optical coatings - Particles and fibers
