By Gencoa Ltd
Gencoa's Coating Development Facility includes a suite of material-development coating systems for depositing on coupons, semiconductor wafers, and both 2D and 3D components. Larger batch and inline sputtering coating systems are available for reproducibility studies, process validation, and pilot production trials. A 1.5m-source batch coater accommodates up to seven vertically mounted cathodes and is particularly suited to multilayer, multi-material, and doped coatings on 3D components. The inline coating system, equipped with a load-lock chamber to support higher throughput operation, can coat flat substrates up to 600mm wide, making it ideal for glass, polymers, and other sheet materials. Advanced vacuum monitoring, process control, and reactive sputtering technologies are integrated across all coating platforms, with DC, pulsed DC, AC, RF, HiPIMS, and Cathodic Arc power options available to suit a wide variety of processes. Each system is also equipped with appropriate plasma cleaning and substrate preparation capabilities to ensure optimal substrate surface activation and coating adhesion.
