By Atomica
Atomica offers die singulation services on both 6” and 8” wafer format. By utilizing a mechanical saw technique, partial slicing to expose bond pads can be incorporated when necessary, a process often refer to as Pad Reveal. Exposure to the bond pads prior to singulation allows for wafer-level testing. Dies are then either shipped on UV curable tape or in individual packages. - Wafer Dicing Wafer dicing is the process of cutting a silicon wafer into individual semiconductor chips or dies. This is typically done using a diamond-tipped saw blade or laser dicing tools, allowing precise cutting along pre-defined scribe lines. - Wafer Dicing Pad Reveal Wafer dicing pad reveal refers to the process of exposing specific areas, such as bond pads, by removing surrounding materials or protective layers during or after the dicing process. This ensures the pads are accessible for bonding or wire connection. - Wafer Dicing Scrub Wafer dicing scrub is a post-dicing cleaning process used to remove particles, contaminants, or residual material left on the wafer after dicing. This process ensures that the dies are clean and ready for packaging.
